Classification of chip test items
When a chip is finally implemented into a terminal product, it generally needs to go through such steps as chip design, wafer manufacturing, wafer testing, packaging, finished product testing, and board-level packaging.
For chips, there are two types of testing, sampling testing and full production testing.
Sampling tests, such as verification tests during the design process, chip reliability tests, chip characteristic tests, etc. These are all random tests. The main purpose is to verify whether the chip meets the design goals. For example, verification testing is to verify whether it meets the design from a functional aspect. The goal, reliability testing is to confirm the lifespan of the final chip and whether it has a certain degree of robustness to the environment, while characterization testing verifies the redundancy of the design.
Here we mainly want to share with you the full production test, which requires 100% full testing. This kind of testing is the process of picking out defects and separating bad products from good products. This kind of testing is divided into wafer testing and final testing (FT, also called packaging testing or finished product testing) according to different stages in the chip value chain.
Chip test project process: Generally, the tests of chip testing companies include many modules such as eflash, AD/DA, LDO/BUCK, RF, etc. In order to provide customers with high-quality products, detailed tests are conducted for each module.
Open/Short Test: Check whether there are open or short circuits in the chip pins.
DC TEST: Verify device DC current and voltage parameters
Eflash TEST: Tests the function and performance of the embedded flash, including various parameters such as read, write and erase actions, power consumption and speed.
Function TEST: Test the logic function of the chip.
AC Test: Verifies AC specifications, including AC output signal quality and signal timing parameters.
Mixed Signal Test: Verify the function and performance parameters of the DUT digital-analog mixed circuit.
RF Test: Test the functions and performance parameters of the RF module in the chip.
