#QFN #QFP #BGA #LGA #PGA #DFN #Chiplet #2.5D #3D #CoWos #FC #FCBGA #FCCSP #SiP #WLCSP #通富 #长电 #华天 #甬矽 #晶方科技 #颀中科技 #伟测 #利扬芯片 #爱德万 #IC #TestSocket #泰瑞达 #ATE

Today, let us deeply analyze the key terms in the chip field, from professional interpretation to popular understanding, to take you to understand this sophisticated and complex world in all aspects.

According to the JESD22-A104 standard, temperature cycling (TC) subjects the parts to changes between extreme high and low temperatures. This test is performed by repeatedly exposing the part to these conditions for a predetermined number of cycles.

Since the unit under test (DUT) area is connected to the pad through the probe, the pad must not be concave or damaged, and the gold surface of the pad must not have scratches or roughness problems.

Save time and money in product development using HALT and HASS testing.

FCS-KLD EV Chips Test Socket,car chip test socket

FCS-KLD making FCS Car MCU Test Socket

FCS AI Chip Test Socket

FCS-KLD making FCS DSP Test Socket, EV DSP Test Socket

FCS-KLD support foundry chips test socket

FCS-KLD making LCD Display FPC Test Socket,LCD Display Test Fixture

FCS-KLD making AI Chip Test Socket