Chip testing is a key link to ensure chip quality and performance, which involves many professional terms. Let's take a deeper look at these terms and transition from professional interpretation to popular understanding.
Wafer Test CP (Chip Probing)
Professional Explanation
The abbreviation of Chip Probing, also known as mid-test, is a test of various performance indicators (such as electrical performance, parameter indicators, etc.) and functional indicators (such as logical functions, etc.) of wafer-level integrated circuits during wafer manufacturing. This test is performed before the chip is packaged and is used to detect the preliminary quality of each chip on the wafer.
Popular Understanding
Imagine that when the chip is still in the "big group" of the wafer and has not "flew alone" (packaged), it is like a group of students who have not graduated in the classroom. At this time, a "mock exam" is held to check the knowledge mastery (performance and functional indicators) of each "student" (chip) to see which "students" have learned well and which may have problems. This is wafer test CP.
Chip finished product test, FT (Final Test)
Professional explanation
The abbreviation of Final Test, also known as final test. After the chip is packaged, it is tested for comprehensive performance indicators (including electrical performance, reliability, etc.) and functional indicators (such as the implementation of specific application functions) to ensure that the chip meets the design requirements and quality standards and can work normally in actual applications.
Popular understanding
Chip packaging is like a student wearing a graduation gown and preparing to officially enter the society. Chip finished product test FT is like the last big test before graduation, which comprehensively checks whether the chip really has all the capabilities it should have and whether it can be successfully "employed" (applied to electronic products). Only by passing this big test can the chip be considered a qualified "graduate".
Yield
Professional explanation
After the tested circuit has gone through all the test processes, the number of circuits with good test results accounts for the proportion of the total number of tested circuits. For chip manufacturing, it is the ratio of the number of qualified chips to the effective chips on the whole wafer (chips that can be used for subsequent packaging and other processes) after completing all the process steps. The higher the wafer yield, the more qualified chips are produced on the same wafer.
Popular understanding
Just like a factory produces a batch of toys, and then they need to be inspected after production. The yield is the ratio of the number of toys that pass the inspection to the number of toys produced in this batch. In chip manufacturing, if the wafer is compared to the raw material for toy production, then the yield is how many qualified chips can be produced from this wafer. The higher the ratio, the more good chips are produced, and the more "cost-effective".
Mapping
Professional explanation
The wafer result mapping diagram presents the test results of each chip (Die) on the wafer in a graphical way, and each square corresponds to the test result of a chip. Through the Mapping diagram, you can intuitively understand the quality distribution of chips at different positions on the wafer, which is convenient for analyzing possible problems in the production process.
Popular understanding
Imagine the wafer as a large map, and each chip on it is a small location on the map. Mapping is a special "map mark", each small square represents a location (chip), and the color or state of the square indicates the test result of the chip, whether it is good or bad, it is clear at a glance. Just like marking which attractions are worth visiting on a tourist map and which ones may not be visited due to maintenance.
Site
Professional explanation
Sub refers to the test station. During the chip testing process, each station is responsible for testing one chip at a time. It is the basic unit of chip testing operation. Different test equipment may contain multiple Sites to improve test efficiency.
Popular understanding
Site is like a test station during an exam. Each test station (Site) only allows one student (chip) to take the test (test) at a time. If there are many test stations (multiple Sites), multiple students can take the test at the same time, so that all students can be tested faster and the speed of the test (test) can be improved.
Tester, ATE (Automatic Test Equipment)
Professional explanation
It is the abbreviation of automatic test equipment (Automatic Test Equipment), which is a device specially used to perform various performance and function tests on chips. It can input various stimulus signals to the chip according to the preset test program, and collect the chip's response signals, and judge whether the chip meets the design requirements by analyzing these signals.
Popular understanding
Tester ATE is like a super powerful "physical examination doctor". The chip is like a patient who comes for a physical examination. The tester performs various examinations on the chip, such as measuring "blood pressure" (electrical performance test) and measuring "reaction ability" (functional test). It will input various signals to the chip according to a set of established physical examination procedures, and then look at the chip's "physical reaction" to determine whether the chip is healthy and whether it can work normally.
Probe station, Prober
Professional explanation
It refers to a test device that automatically transfers wafers to the test position piece by piece, so that the pins of the chip are connected to the functional module of the tester through probes and special connecting wires. Its function is to accurately locate the wafer and establish an electrical connection between the chip and the tester for testing.
Popular understanding
The probe station is like an intelligent "courier and switchboard operator". It first accurately delivers the wafer (a large plate of chips) to the test site one by one, and then connects the pins of the chip to the tester with probes and connecting wires like connecting wires, so that the tester can smoothly "check the body" of the chip and transmit test signals.
Test board, Load Board
Professional explanation
The load board or carrier board is a fixture used to test finished chips after packaging. It provides an electrical connection interface for the chip, which can connect the chip to the tester, and provide stable mechanical support and electrical environment for the chip to ensure the accuracy of the test.
Popular understanding
The test board is like a "dedicated small bed" for chip testing. The packaged chip lies on this "bed" (test board), and through various interfaces and lines on this "bed", it can "hand in hand" (connect) with the tester. This "bed" can not only hold the chip steadily, but also provide a suitable "environment" for the chip, so that the tester can accurately test the chip.
Sorter, Handler
Professional explanation
According to the different properties of integrated circuit chips (such as performance parameters, functional characteristics, etc.), it is graded and screened, and at the same time, it is an automated device that can automatically transfer chips to the test position piece by piece. It can improve the efficiency of chip testing and screening, and classify chips of different quality grades.
Popular understanding
The sorter is like a smart "classification expert". The chip is like a pile of items to be classified. The sorter classifies the chips into different grades according to the various "abilities" (performance, functions, etc.) of the chip. It can also deliver the chips to the test site one by one like a small porter, and finally organize the classified chips for subsequent use.
Probe card, Prober
Professional explanation
A circuit board used in integrated circuit wafer testing, whose function is to achieve connection with wafer-level chips. There are many probes distributed on the probe card, which can accurately dock with the pins (Pad) of the chip on the wafer, thereby establishing an electrical connection between the chip and the tester and transmitting the test signal.
Popular understanding
The probe card can be regarded as a "signal bridge". During wafer testing, the chip pins (Pad) are like one end of the bridge, the tester is like the other end of the bridge, the probe card is the middle bridge body, and the probes on it are the "channels" on the bridge, which can smoothly transmit the test signal from the tester to the chip, and then transmit the chip's response signal back.
Fixture, ConversionKit
Professional explanation
An accessory used for integrated circuit testing, usually designed and manufactured to meet specific testing needs. Fixtures can assist in the positioning and connection of chips during the test process to ensure the accuracy and stability of the test. Different test scenarios may require different types of fixtures.
Popular understanding
The fixture is like a "little helper" during chip testing. During testing, sometimes it is not enough to rely on large equipment alone, and some small tools are needed to help fix and connect the chip. Just like when we repair something, in addition to a large wrench, we also need small tools such as small screwdrivers and tweezers to assist in the operation. The fixture plays this auxiliary role in chip testing.
Pins
Professional explanation
Also known as pins, it is a wiring that is connected to the peripheral circuit from the internal circuit of the integrated circuit. Pins are the key part of the electrical connection between the chip and the external circuit. Through the pins, the chip can receive external input signals, output internal processing signals, and interact with other electronic components.
Popular understanding
The pins are like the "little tentacles" of the chip. The chip needs to "communicate" with the external circuit, and it depends on these "little tentacles". For example, if the chip needs to receive power supply or transmit its processed signals to other components, it must be transmitted through these "little tentacles", just like we use our hands to pass things.
Pin
Professional explanation
Refers to the probe, which is a metal needle that connects the wafer pin and the probe card. During the wafer test process, the Pin can accurately contact the pin of the chip on the wafer, thereby establishing an electrical connection, allowing the test signal to be transmitted between the probe card and the chip.
Popular understanding
The Pin is like a small "conductive needle". During the test, it is connected to the probe card at one end and the pin of the chip on the wafer at the other end, just like the two ends of the wire. Through it, the test signal can run back and forth between the probe card and the chip like an electric current, allowing the test machine to smoothly detect the chip.
Pad
Professional explanation
Refers to the wafer pin, and the IC pin is led out on the wafer in the form of an aluminum pad. Pad is the transition area where the internal circuit of the chip is connected to the external pin. It is usually made of conductive materials such as aluminum. Its function is to provide a physical interface for the chip pin that is easy to connect and test.
Popular understanding
Pad can be imagined as a "transit station" for the internal and external connections of the chip. The circuit signal inside the chip must pass through this "transit station" to be transmitted to the pin. It is like a small platform, and the pins can be easily connected to it, so that the signal can be smoothly transmitted from the inside of the chip to the external circuit.
Soc (System-on-Chip)
Professional explanation
System-on-Chip is the abbreviation of logic and mixed signal chip, also known as system-level chip. It is an electronic system formed by integrating multiple integrated circuits with specific functions (such as processors, memory, interface circuits, etc.) on a single chip. Soc can realize complex system functions in one chip, greatly improving the integration and functional density of the chip.
Popular understanding
Soc is like a "super mini computer". Many important things such as the CPU, memory, various interface circuits in the original computer are condensed into a small chip. A Soc chip can complete many complex tasks, just like a complete computer system in a small box, which is powerful and does not take up space.
About Kailidi
Shenzhen Kailidi Technology Co., Ltd. was established in 2013 and is a high-tech enterprise focusing on semiconductor testing solutions. We are committed to providing customers with full-process testing solutions from chip design verification, third-party reliability testing to ATE mass production testing, helping customers accelerate product launch and enhance market competitiveness.
Core advantages
Experienced technical team: We have an engineering and technical team with more than 15 years of experience, with professional electronic circuit development, software development, mechanical 3D design and system integration capabilities, and can provide customers with professional technical support and customized services.
Continuous technological innovation: We are always committed to technological innovation and product upgrades, and continuously launch advanced testing solutions that meet market needs.
High-quality products and services: We adhere to a strict quality control system to ensure the high reliability and stability of our products, and provide customers with professional and efficient chip testing solutions.
Main products and services:
1) CPU/GPU/FPGA large chip/automotive chip aging test socket: Provide high-performance and high-reliability aging test sockets for different packaging types and testing requirements to meet the stringent requirements of HTOL aging testing and ATE mass production testing.
2) RF RF test solution: Provide comprehensive RF test solutions, covering all aspects from R&D to mass production, to help customers improve the performance and reliability of RF chips.
3) Customized ATE test socket/test fixture: Provide customized test socket and test fixture design services according to customer's specific needs to meet customers' personalized testing needs.
[Contact] Jasmine Yan
[Mobile] 137-9855-8026 (same as WeChat)
[Email] jasmine@fcssemi.com
[Website] www.fcssemi.com
#QFN #QFP #BGA #LGA #PGA #DFN #Chiplet #2.5D #3D #CoWos #FC #FCBGA #FCCSP #SiP #WLCSP #通富 #长电 #华天 #甬矽 #晶方科技 #颀中科技 #伟测 #利扬芯片 #爱德万 #IC #TestSocket #泰瑞达 #ATE
