According to the JESD22-A104 standard, temperature cycling (TC) subjects the parts to changes between extreme high and low temperatures. This test is performed by repeatedly exposing the part to these conditions for a predetermined number of cycles.

Since the unit under test (DUT) area is connected to the pad through the probe, the pad must not be concave or damaged, and the gold surface of the pad must not have scratches or roughness problems.

Wide compatibility: Supports a variety of package types, including BGA338, BGA484-0.8, BGA516, BGA1275, BGA4755, BGA5602, CPU BGA809, FPGA BGA900, etc., which can meet the testing needs of different manufacturers and different models of chips.

Wide Application Laboratory Aging Verification Third-party Reliability HTOL/HAST Mass Production Aging Selection

It is widely used in ATE test machines of domestic packaging and testing manufacturers, such as Tongfu, Changdian, Huatian, Yongsi, Jingfang Technology, Qizhong Technology, Vtest, Liyang Chip,

Save time and money in product development using HALT and HASS testing.

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