KLD One-stop Automotive xEV Chips Aging Socket Solution
① LED headlight F
② Motor and electronic control F
③ Camera
④ Powertrain
⑤ Panel
⑥ Storage IC
⑦ ADAS
⑧ AI chip
⑨ RF
⑩ Smart cockpit
⑪ In-vehicle Ethernet
⑫ In-vehicle charging
⑬ DC/DC
⑭ LED headlight B
⑮ Motor and electronic control B
⑯ Battery
1. Control chip MCU
2. Computing chip SoC
3. Power chip IGBT/SiC/GaN/MOSFET
4. Sensor CIS
5. Memory chip Memory
6. Power chip PMIC -
7. Communication chip WLAN, CAN/LIN/NFC, ETC
8. Information security eSIM/eSAM/T-Box/V2X
9. Driver chip Drivers
10. Others
BI Socket Features
1. Multiple mold models: Most QFN/QFP/BGA
2. Precise process: Ensure product consistency and reduce processing and testing costs
3. High precision: Minimum diameter 0.17mm±0.01mm
4. Stable test: High mass production efficiency
5. Long life: Maximum test life can reach 100,000 times
6. Fast delivery: Standard products, fastest delivery on the same day
7. Easy to use: No welding required, Open-top structure, suitable for automated equipment
BI Socket Data:
1. Material application: PES/LCP/PEEK
2. Pitch: ≥ 0.35mm
3. Structure: Press down/Flip cover optional
4. Contact method: Probe/Spring optional
5. Working temperature: -55°C～+175°C
Wide Application
Laboratory Aging Verification
Third-party Reliability HTOL/HAST
Mass Production Aging Selection
