Wide compatibility: Supports a variety of package types, including BGA338, BGA484-0.8, BGA516, BGA1275, BGA4755, BGA5602, CPU BGA809, FPGA BGA900, etc., which can meet the testing needs of different manufacturers and different models of chips.

Wide Application Laboratory Aging Verification Third-party Reliability HTOL/HAST Mass Production Aging Selection

It is widely used in ATE test machines of domestic packaging and testing manufacturers, such as Tongfu, Changdian, Huatian, Yongsi, Jingfang Technology, Qizhong Technology, Vtest, Liyang Chip,

LTM4644 LTM4600 LTM4600IV BGA package power converter module original LINEAR Kailidi BGA77 BGA144 test socket

FCS RF Test Socket,High Frequency Chip Test Socket

BGA77 PMU BI Socket,BGA77 Socket

FCS-KLD making all kinds of IC Test Socket

FCS-KLD making BGA IC Test Fixture

IC Design Socket Test, IC Design Testing

FCS-KLD Infrared Module Test Socket

FCS-KLD MEMS Test Socket,MEMS Sensor Test