KLD customizes CPU/GPU/TPU/FPGA and other high-power chip test sockets to help chip R&D and mass production
KLD Tech, as a leading semiconductor test solution provider, today announced the launch of a new generation of large chip test sockets, designed to meet the growing testing needs of large chips such as SoC, DSP, CPU, TPU, xPU, GPU, FPGA and ASIC.
KLD large chip test socket has the following advantages:
Wide compatibility: Supports a variety of package types, including BGA338, BGA484-0.8, BGA516, BGA1275, BGA4755, BGA5602, CPU BGA809, FPGA BGA900, etc., which can meet the testing needs of different manufacturers and different models of chips.
High performance: Using high-quality materials and precision processing technology to ensure the high reliability and stability of the test socket, meeting the stringent requirements of HTOL aging test and ATE mass production test.
Customized service: Customized test socket design services can be provided according to the specific needs of customers, helping customers to quickly realize chip R&D debugging and mass production testing.
KLD large chip test sockets have been successfully applied to many well-known chip manufacturers, including Intel, AMD, Navida, Haiguang Information, Cambrian, Zhongke Longxun, Ziguang Tongchuang, Gaoyun Semiconductor, etc., providing strong support for their chip R&D and mass production.
KLD has always been committed to providing customers with high-quality and high-performance semiconductor testing solutions, helping customers accelerate product launch and enhance market competitiveness.
Shenzhen KLD Technology Co., Ltd.: Professional semiconductor test socket solution provider
About us
Shenzhen KLD Technology Co., Ltd. was established in 2013 and is a high-tech enterprise focusing on semiconductor testing solutions. We are committed to providing customers with full-process testing solutions from chip design verification, third-party reliability testing to ATE mass production testing, helping customers accelerate product launch and enhance market competitiveness.
Core advantages
1)Experienced technical team: We have an engineering and technical team with more than 15 years of experience, with professional electronic circuit development, software development, mechanical 3D design and system integration capabilities, and can provide customers with professional technical support and customized services.
2)Continuous technological innovation: We are always committed to technological innovation and product upgrades, and continuously launch advanced testing solutions that meet market needs.
High-quality products and services: We adhere to a strict quality control system to ensure the high reliability and stability of our products and provide customers with professional and efficient chip testing solutions.
Main products and services:
1) CPU/GPU/FPGA large chip/automotive chip aging test socket: Provide high-performance and high-reliability aging test sockets for different packaging types and testing requirements to meet the stringent requirements of HTOL aging testing and ATE mass production testing.
2)RF RF test solution: Provide comprehensive RF test solutions, covering all aspects from R&D to mass production, to help customers improve the performance and reliability of RF chips.
3) Customized ATE test socket/test fixture: Provide customized test socket and test fixture design services according to customer specific needs to meet customer personalized testing needs.
【Contact】Jasmine Yan
【Mobile】137-9855-8026 (same as WeChat ID)
【Email】jasmine@fcssemi.com
【Website】www.fcssemi.com
