MEMS sensor chip aging test socket
Benefiting from the high growth of the global MEMS sensor market, my country's MEMS sensor market continues to prosper.
At present, my country's MEMS sensor industry has initially formed a one-stop system for design, processing, packaging, and testing.
Judging from the summary of my country's MEMS sensor listed companies, my country's industrial layout is in sub-fields such as acoustics, optics, pressure, and inertia.
Among them, there are as many as 25-50 MEMS sensors used in smart cars, with a wide range of types. Pressure sensors, accelerometers, flow sensors, gyroscopes, and temperature and humidity sensors together make up more than 99% of automotive MEMS systems.
MEMS sensor chip aging seat
As the sensor market booms, there are increasing demands for testing and aging of related chips.
DFN\SOP\micro package CQFP packages have become the main packages for sensor chips.
There are more and more inquiries in the aging socket market with similar packaging.
Kailidi launched the OpenTop lower-pressure aging socket that uses the above-mentioned packaged chips to help enterprises accelerate the aging of chips with automated equipment.
The advantage of the push-down aging seat is that it can cooperate with automation to achieve rapid testing and improve efficiency.
The mold opening probe has a longer and more stable life, and is fixed to the PCB board with screws, making it easy to disassemble and not wasting aging boards.
Maximum temperature is 165 degrees Celsius. Meet the aging test of MEMS packaging and testing companies on their chips.
