At the moment when the wave of chip technology is sweeping in, various professional terms are dazzling. Today, let us deeply analyze the key terms in the chip field, from professional interpretation to popular understanding, to take you to understand this sophisticated and complex world in all aspects.
Integrated Circuit (IC)
Professional Explanation
An integrated circuit (IC) is a circuit with specific functions that integrates a certain number of electronic components, such as resistors, capacitors, transistors, etc., and the connections between these components through semiconductor technology. It is the core technology for miniaturization and high performance of electronic systems in modern electronic technology.
Popular Understanding
Imagine a bunch of small electronic parts, like building Lego, and use special processes to connect them tightly together to form a circuit board that can complete a specific task. This is an integrated circuit. For example, the circuit that can process signals in a mobile phone is the work of an integrated circuit.
Chip
Professional Explanation
The chip is the carrier of the integrated circuit, which is the final result after the integrated circuit is designed, manufactured, packaged, and tested. It is a miniaturized electronic device that integrates a large number of electronic components and circuit systems and is widely used in various electronic devices.
Common understanding
The chip is like the "finished house" of the integrated circuit. After the integrated circuit is designed and manufactured, it goes through a series of packaging and inspections, and finally becomes a small thin piece that can be directly installed in electronic products to enable electronic products to realize various functions, such as computer CPU chips. Without it, the computer cannot run.
Silicon wafer
Professional explanation
Silicon wafer, also known as bare wafer, is a round thin piece made of silicon crystal. It is the basic semiconductor material for making chips. Silicon has good semiconductor properties and is widely used in chip manufacturing.
Common understanding
Silicon wafer is the "raw material cake" for making chips. It is a round wafer made of silicon, a special material. All subsequent chip processing must be carried out on it, just like building a house requires a good piece of land.
Wafer
Professional explanation
Wafer, also known as round wafer, is a series of semiconductor manufacturing processes such as photolithography, etching, and doping on bare wafers (silicon wafers) to process and produce various circuit component structures, thus becoming the prototype of integrated circuit products with specific electrical properties.
Popular understanding
The wafer is the product of further processing of the silicon wafer, just like carving various complex small houses and small roads (circuit component structures) on the "raw material cake", slowly forming a functional "community", which is the appearance of the future chip.
Wafer (Die)
Professional explanation
The wafer, also known as a bare chip, grain or bare die, is a small piece of integrated circuit body made of semiconductor materials and not packaged. The established functions of the integrated circuit are realized on this small piece of semiconductor.
Popular understanding
The wafer is a small part cut from the wafer. It is the appearance of the chip before it wears "protective clothing" (package). It already has the basic functions of the chip, like a small "functional heart", but it still needs protection and packaging before it can officially start work.
Packaging
Professional explanation
Packaging refers to the packaging of integrated circuits, which is the final stage of semiconductor device manufacturing. Through a specific process, the chip is connected to external connection structures such as pins, and the chip is protected by packaging materials so that it can adapt to different working environments and facilitate connection with external circuits.
Popular understanding
Packaging is to put a "protective coat" on the chip and install a "small handle" (pin) to make the chip work stably and conveniently "hand in hand" (connect) with other electronic components, just like wrapping fragile items with thick foam and then installing a handle for easy carrying.
Packaging and testing
Professional explanation
Packaging and testing is the abbreviation of the packaging and testing business of integrated circuits. After the packaging process is completed, the electrical performance and functions of the chip are tested through a series of testing methods to ensure that the chip meets the design requirements and quality standards.
Popular understanding
Packaging and testing is to put a "coat" on the chip first, and then "test" the chip to see whether the various functions of the chip are qualified and whether they can work normally, just like doing quality inspection and packaging for the manufactured products.
Moore's Law
Professional explanation
A phenomenon in the integrated circuit industry proposed by Gordon Moore, one of the founders of Intel, in 1965. Its content is: when the price remains unchanged, the number of components that can be accommodated on an integrated circuit will double approximately every 18-24 months, and the performance will also double. It reflects the speed and trend of semiconductor technology development to a certain extent.
Popular understanding
Moore's Law is like setting a "small upgrade goal" for the chip industry. Every one and a half to two years, the number of electronic parts that can be installed in a chip of the same price will double, and the performance will also become stronger, just like the performance of mobile phones that can be bought at the same price will be better every once in a while.
Foundry
Professional explanation
In the integrated circuit industry, foundry refers to a company that specializes in wafer manufacturing. It accepts commissions from IC design companies to manufacture wafers. It does not design chips itself, but focuses on improving wafer manufacturing process technology and expanding production capacity.
Popular understanding
Foundry is the "processing plant" for chip manufacturing. IC design companies draw "design drawings", and foundries produce wafers according to the drawings. They do not participate in chip design, but are only responsible for making wafers, just like foundries help brand manufacturers produce products.
Fabless
Professional explanation
Fabless is a fabless chip design company model. Under this model, companies only engage in the design and sales of integrated circuits, and outsource wafer manufacturing, packaging, testing and other production links to professional wafer manufacturing companies and packaging and testing companies through commissioned processing.
Common understanding
Fabless companies are like "creative studios" for chips. They are only responsible for coming up with the functions and designs of chips, and then hand over the actual production and manufacturing work, such as wafer manufacturing, packaging, testing, etc., to other professional factories, and concentrate on designing and selling chips.
Chipless
Professional explanation
Chipless is a new business model, which refers to some large-scale electronic equipment companies that design and develop chips by themselves. The chips are mainly used by themselves to improve product differentiation and competitiveness, while chip manufacturing, packaging, testing, etc. are all entrusted to external professional manufacturers for processing.
Common understanding
Companies in the chipless model are like "big buyers of independent creativity". They design chips for their own products. In order to make the products more unique and competitive, they do not build their own factories for production, but outsource the chip manufacturing and other links, just like a restaurant develops new dishes by itself, but hands over the processing of ingredients to professional suppliers.
IDM (Integrated Design and Manufacture)
Professional explanation
IDM is a vertical integration model, which means that the company can complete all links such as chip design, wafer manufacturing, packaging and testing independently, has the production capacity of the complete chip industry chain, and has independent control capabilities in all stages of chip research and development and production.
Popular understanding
IDM companies are like "all-round factories" in the chip industry. From the "brainstorming" of chip design, to the "raw material processing" of wafer manufacturing, to the "finished product quality inspection and packaging" of packaging and testing, all processes can be handled by themselves, one-stop service, and nothing depends on others.
About Kailidi
Shenzhen Kailidi Technology Co., Ltd. was established in 2013 and is a high-tech enterprise focusing on semiconductor testing solutions. We are committed to providing customers with full-process testing solutions from chip design verification, third-party reliability testing to ATE mass production testing, helping customers accelerate product launch and enhance market competitiveness.
Core advantages
Experienced technical team: We have an engineering and technical team with more than 15 years of experience, with professional electronic circuit development, software development, mechanical 3D design and system integration capabilities, and can provide customers with professional technical support and customized services.
Continuous technological innovation: We are always committed to technological innovation and product upgrades, and continuously launch advanced testing solutions that meet market demand.
High-quality products and services: We adhere to a strict quality control system to ensure the high reliability and stability of our products and provide customers with professional and efficient chip testing solutions.
Main products and services:
1) CPU/GPU/FPGA large chip/automotive chip aging test socket: Provide high-performance and high-reliability aging test sockets for different packaging types and testing requirements to meet the stringent requirements of HTOL aging testing and ATE mass production testing.
2) RF radio frequency test solution: Provide comprehensive RF test solutions, covering all aspects from R&D to mass production, to help customers improve the performance and reliability of RF chips.
3) Customized ATE test socket/test fixture: Provide customized test socket and test fixture design services according to customer specific needs to meet customer personalized testing needs.
【Contact person】Jasmine Yan
【Mobile phone】137-9855-8026 (same as WeChat ID)
【Email】jasmine@fcssemi.com
【Website】www.fcssemi.com
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