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CMOS sensor BGA144-0.8 10×10 flip alloy test socket

  • CMOS sensor BGA144-0.8 10×10 flip alloy test socket

CMOS sensor BGA144-0.8 10×10 flip alloy test socket

CMOS sensor BGA144-0.8 10×10 flip alloy test socket
Product name: CMOS sensor BGA144-0.8 10×10 flip alloy test seat
Package size: BGA144

Product Features: The top window of BGA144 is needed for top sensing effect, ensuring reliable connection at the bottom and ensuring signal transmission simultaneously;

Product usage: CMOS sensor testing, functional verification, aging testing, etc.

CMOS sensor BGA144-0.8 10×10 flip alloy test socket

 

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