Actual requirements:
1.Package: BGA
2. Number of Pins: 132
3. Number of grounding connections: 0pin
4. Chip type: MCU high-speed control unit module chip
5. Test requirements: chip signal testing and burning purposes
3. Requirements analysis: The chip is in a BGA132 package with a pitch of 0.4mm. It can also be called a WLCSP package. The size is 5.4*6.2mm. The test is mainly for signal function testing. The test conditions: test 12-pin high-speed differential signals. The maximum frequency is 2.7GHz, the maximum speed is 5.4Gbps, and the remaining pins are conventional conductive interfaces. When tested at room temperature, that is, 30°C, the entire chip consumes low power and the single pin current is less than 1A.
4. Production: Use a flip-top interface to ensure perfect contact with the 132-pin contact lead of the chip. Introduce contact impedance. The probe uses a 3Ghz probe adapted to high-speed and high-frequency signal matching to ensure perfect conduction of frequency and rate.
5. After the production is OK, preliminary conduction confirmation of the chip test socket and tolerance control and inspection of each size need to be carried out.
