Actual requirements:
1.Package: CSOP package, ceramic package, SOP package
2. Number of Pins: 52
3. Number of grounding connections: 0pin
4. Chip type: military ceramic package EPROM
5. Test requirements: chip signal test and aging test
3. Demand analysis: The structure of the ceramic package is different from that of the plastic package, so the structure of the test socket is also slightly different, mainly reflecting the lead length, pressure control and pressure block pressing arrangement; therefore, the test socket should avoid the front of the chip The avoidance position and the guidance and protection of the pins from deformation, etc.; size: chip spacing 0.5mm, chip size 6.4 (12.2) * 15.34 * 1.8mm. According to the chip shape, some avoidance adjustments need to be made inside the test socket.
4. Production: The difficulty of production lies in the pins of the chip and the position of the chip bump to avoid the air. The other test requirements are 150℃*2000 hours of testing. These requirements are not high, that is, the material and processing requirements of the test socket are very high. A more refined level of processing and tolerance control is required.
5. Quality inspection and delivery: If the product is produced ok, it is necessary to strictly confirm its pinholes and corresponding avoidance and pin analysis. The spacing between these pins is 0.5mm, and the space for the pin placement will be smaller.
