430 series microcontroller BGA113 test socket
1. Actual requirements:
1.Package: BGA package
2.Pin number: 133pin
3. Spacing: 0.5mm
4. Chip type: 430 series microcontroller
5. Testing requirements: chip functional debugging, programming and mass production
2. Chip characteristics: actual use and working conditions of the chip, its low power supply voltage range: 1.8V to 3.6V, ultra-low power consumption, working mode: 365 µA when the frequency is 1 MHz and the voltage is 2.2V, standby mode (VLO): 0.5 µA – Shutdown mode (RAM retained): 0.1 µA, wake up from standby mode in 1 µs. The requirements for its chip are not high because its function is a microcontroller, so its current, voltage, frequency, etc. are not high. At the same time, its size is analyzed. The pitch is 0.5mm, the shape is 7*7mm, and the ball array is distributed in an annular shape.
3. Requirements analysis: The chip has very low testing requirements and can be made using a shrapnel design. At the same time, it can be matched with the socket head of a ready-made mold structure, as shown in the figure below. The test socket needs to meet -45~125℃ , 100 hours of aging test, and in order to save time, users hope to write firmware at the same time during the test. This puts forward higher requirements for the test socket, but don’t panic. Our current design uses a double-sided elastic design + mold shell, which can support a clock frequency of about 200MHz and a burning requirement of 400MHz. This value can match many high-speed programming device. The double-sided bomb is designed like a probe-like mechanism, which is in the form of surface contact. It can be fixed with screws, which facilitates quick replacement during mass burning and improves efficiency.
4. During the production process, each customized component is strictly inspected to confirm that the structure of the chip is within the allowable range. Only after all components are confirmed to be ok can they be assembled, and the overall inspection is completed before shipment.
