BGA323 SOC package flip knob test socket

Actual requirements:

1.Package: BGA package SOC type

2. Number of Pins: 323

3. Number of grounding connections: 0pin

4. Chip type: CM68681 module

5. Testing requirements: chip function testing and programming purposes

3. Requirements analysis: The PCIe interface of the entire module supports a maximum rate of 2.5Gbps; the serial port interface supports RS232, RS422, and RS485, the communication rate is up to 4Mbps, and the SPI clock is 22Mhz; the power consumption is 1A/3.3V (95% bus load); test temperature : -40~125℃; chip spacing: 1.5mm, size: 30*30*4.8mm; Pin number: 323; the entire test seat probe needs to meet high-speed requirements and work properly with PCIe; it also needs to cooperate with the aging test; due to For SOC packaging, it should be noted that the IC on the top of the module needs to match the profiling design of the pressure block to avoid damage to other components being certified;

4. Production: A semi-customized solution is adopted. The structure of the test seat can use the existing knob to flip the test seat shell. The main body of the internal test seat is customized by CNC. The 1.5-pitch tight processing hole requirements are required. At the same time, attention should be paid to the spherical profiling guidance. ; The top pressing block can only press the black body IC on the top of the SOC chip. The IC bears the main pressure of the upper cover, ensuring that the top chip is not damaged and can be pressed better;

5. After production is completed, quality inspection will be conducted on all dimensions of the test seat, and each dimension marked on the drawing will be strictly inspected to confirm that it is correct before assembly; while assembling, the profiling design of the top pressure block will be carried out to confirm whether the design affects other parts. Components; SOC module shape tolerances are large and multiple samples are required for confirmation.