BGA1144 Flying Totem Desktop Processor Test Fixture

BGA1144 Flying Totem Desktop Processor Test Fixture

I. Requirements: on the basis of the original motherboard, make a test stand and fixed to the original motherboard, and through the switching machine and with other boards and cards for a full range of chip performance testing; chip using ARM core, 4-core, 2.6GHz ~ 3GHz main frequency, support for 2pcs * 72-bit DDR4-3200; power consumption of 10W or so; the number of pins: 1144, spacing: 1.0mm ;

Second, analyze:

1. The structure of the motherboard is analyzed to determine whether the installation of the test bench is feasible? If it is not feasible, it is necessary to consider using other programs to complete the conduction;

2. The performance of the chip to match the corresponding high-performance probe, for the corresponding frequency, I / O and other pinmap, analysis, confirmation of the test seat of the various networks need to correspond to the distribution;

3. Whether CPU chips need to do heat dissipation processing;

4. The high frequency requirements of the interoperable pins with DDR, and the analysis of the power supply network to match the corresponding current probe;

Third, the production of products as well as materials:

1. Provide the motherboard 2pcs, an original board comparison, an original board to remove the chip;

2. Testable chips: 3~5pcs, for jig production ok, for testing;

3. planning jig body design, chip size design test seat internal structure, test seat external structure needs to be combined with the motherboard to determine its corresponding installation, avoiding empty components and other issues, the current motherboard heat sink structure to do a great deal of peripheral components in the controllable range of the position and so on, it can be very simple to design a fixed structure and do a good job of installing the structure; at the same time the design of the fine positioning aspects of the board is also try to use the original board Can be;

4. After analysis, matching the corresponding clock frequency part, DDR signal integrity and high-speed signal part, each power management part, etc., need to do a good job in the corresponding partition design and matching, in the case of the same structure, can be common pin type, reduce processing difficulties, reduce costs and production lead time; do a good job of tin ball guidance and corresponding design of the top of the copper heat sink and synchronization of the conductor to the top of the heat sink Fin for heat dissipation;

5. Make ok assembly, and carry out the necessary power-on and performance testing, confirm ok; confirm the various steps of the test according to the user requirements, shoot a video to the user to confirm, and inform the operating procedures and the use of contraindications;