QFP44 0.8 aging test socket

Package size: Supported package types are QFP, TQFP, etc., body width size: 10.5*105mm, lead size: 12*12mm, pitch 0.8mm;

Test support: QFP chips have various uses, and are generally used as power supplies, MCUs, etc.; therefore, they are often used for burning firmware and MCU aging tests, etc.

Product features: molded products, welded to test PCB, stable contact and supports high-speed pick and place testing;

Product usage: -45~155℃ wide dynamic aging test requirements, cycle test with aging time up to 1000 hours;