Package size: QFN package, 0.35mm pitch, 5*5mm size
Test support: micro MCU packaging and other chips,
Product features: resistant to high and low temperatures -45~155℃, strong temperature resistance of the shrapnel, low contact impedance, stable contact; it can be well matched with basic level testing, and the low impedance performs well in micro-electrical aging test sockets.
Product use: aging test and programming of HAST, HTOL, PCT, etc. and the same package
QFN48 0.35 5*5 aging seat
