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QFN48 0.35 5*5 aging seat

  • QFN48 0.35 5*5 aging seat

QFN48 0.35 5*5 aging seat

Package size: QFN package, 0.35mm pitch, 5*5mm size

Test support: micro MCU packaging and other chips,

Product features: resistant to high and low temperatures -45~155℃, strong temperature resistance of the shrapnel, low contact impedance, stable contact; it can be well matched with basic level testing, and the low impedance performs well in micro-electrical aging test sockets.

Product use: aging test and programming of HAST, HTOL, PCT, etc. and the same package

QFN48 0.35 5*5 aging seat

QFN48 0.35 5*5 aging seat

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