KLD Wholesale eMMC UFS BGA153 aging test socket test fixture EMMC test stand BGA153 test aging socket mobile phone security industrial control board
➢ The structure is a downward pressure spring test socket with a stable structure;
➢ Designed specifically for BGA packaged chips with a pitch of 0.5mm, with strong compatibility;
➢ Space-saving compact design reduces the pressure requirement during testing;
➢ Innovative structure effectively prevents ball jamming;
➢ Equipped with replaceable limit frames, positioning grooves and guide holes with high precision to ensure accurate testing;
➢ Flexible application of different types of probes to meet the requirements of IC with and without solder balls;
➢ Convenient design makes probe replacement simple and maintenance cost low, thereby reducing the overall test cost;
➢ Use imported probes and high-quality engineering materials, combined with precision manufacturing technology, to ensure the stability and long life of the test socket.
