Internal wafer AOI detection LCC28-1.27 aging test seat
2. Actual requirements:
1.Package: LCC28
2. Number of Pins: 28
3. Number of grounding connections: 0pin
4. Chip type: military tube and shell type LCC ceramic chip
5. Testing requirements: Test performance before packaging and perform AOI inspection of internal wafers
3. Demand analysis: Chip package: LCC28-1.27-11.43*11.43mm. The front of the chip is not stressed. The pressing block is made with a skylight on the 4 sides. A skylight of the same size as the top is also required at the bottom. The gap at the edge of the chip is about 0.5mm, the power supply is less than 500mA, there is no frequency requirement, just conduction is required, and it also needs to cope with high temperature conditions of -45~155℃;
4. Production: Clamshell test seat structure, the pressing block needs to strictly match the range of the lower DUT house to avoid shifting due to tolerance issues and blocking the shell and wafer parts. The material is made of PEEK material, which is finely processed and assembled to test in the housing. Since the pin spacing of the chip is 1.27mm, a probe with a thickness of 078mm can be used to ensure stable contact;
5. After the production is completed, all dimensions of the test socket will be inspected for quality, and each dimension marked on the drawing will be strictly inspected. Once confirmed, it can be assembled; while assembling, 10pcs samples need to be repeatedly manually adapted and verified; the assembly is completed. After that, the chip needs to be placed in the aging test seat of LCC28-1.27 to observe whether it blocks the package wafer. If everything is OK, it can be shipped.
