DRAM IC memory chip particle BGA60-0.8 functional aging test seat
1. Actual requirements:
1.Package: BGA package
2. Number of Pins: 60pin
3. Spacing: 0.8mm
4. Chip type: memory particles;
5. Test requirements: chip functional debugging and mass production aging test
2. Chip characteristics: 60-ball memory particle test socket, mainly for SDRAM-LPDDR, volatile memory chip testing, clock frequency 166mhz, voltage 1.7~1.95V;
3. Requirements analysis: The chip package size is: BGA60-0.8-8*9mm. The positioning and limit design of the test socket should be based on the corresponding tolerance matching standards. Just design the test socket. In terms of frequency and current, there are no special requirements, but it needs to be done at the same time. Passed high temperature dynamic test of -45~155℃;
4. After confirming the design structure of the drawing, production can be strictly carried out according to the drawing. After the product is made, it can be sent to the user for actual board testing.
