1. Actual requirements:
1.Package: SOT89 package
2. Number of Pins: 3
3. Number of grounding connections: 0pin
4. Chip type: RF IC
5. Test requirements: spacing 1.5mm, size: 4.5×4.095mm RF signal 4G, insertion loss not less than 1dB, return loss less than 20dB, current 170ma, temperature: -55–85°C. It is used for batch testing of chip packaging, so the lid will be opened and closed frequently; it mainly tests S parameters and DC parameters, so the contact requirements between the ejector pins in the tooling and the product pins are absolutely good.
2. Demand analysis: According to the above requirements, radio frequency testing mainly requires probes to meet the S parameters and DC parameters of the chip. The chip consumes large power and requires copper blocks for heat dissipation, and the bottom shielding ground is introduced into the test. The shielding effect in the test socket is very good, making the test more stable.
3. Production: Strict size control, as well as the design and installation of shielding copper blocks, need to ensure contact while ensuring test signal integrity.
4. Shipping requirements: After the above test socket is confirmed to be ok, it can be shipped;
