1. Actual requirements:
1. Package: LCC48 package
2. Number of Pins: 48
3. Number of grounding connections: 9pin
4. Chip type: Silicon photonic integrated coherent transceiver chip
5. Test requirements: Chip aging test requirements: -55~155℃ dynamic aging test; optical signal connection test, impedance matching is required to ensure maximum energy efficiency of signal sending and receiving; cooling speed needs to be changed quickly, and liquid nitrogen needs to be used for rapid cooling.
2. Demand analysis: Optical mode chips are mainly used for signal transmission and reception. It is necessary to pay attention to the matching of the chip and the test socket, as well as the integrity of the signal and the high-speed signal performance. In addition, the chip has an optical fiber connector and needs to be protected from the corresponding socket. , in addition, due to the need to do a rapid dynamic aging test, a tapping hole needs to be made on the top for the installation of the liquid nitrogen joint;
3. Production: Rapid testing of high and low temperatures places high demands on the test socket, which requires prevention of rapid low-temperature embrittlement; high-speed radio frequency signal and impedance matching functions of the PCB; therefore, the materials of the probe, PCB and test socket are very important. high demands;
4. What needs to be paid attention to is the application of materials and the size matching of the chip. There are no other problems. After the test is OK, it can be applied to the test substrate.
