SOP/SOIC packaged optocoupler chip aging test socket
2. Actual requirements:
1.Package: SOP/SOIC package
2. Number of Pins: 4pin
3. Number of grounding connections: 0pin
4. Chip type: Optocoupler chip
5. Test requirements: Optocoupler aging test
3. Demand analysis: The requirements for the chip aging test of the optocoupler are mainly -45~135℃ aging test. The test duration is 100 hours. The test requirements are not high. However, due to the packaging form of the chip and user cost issues, It is necessary to find an existing mold chip test socket to match. The body of the optocoupler is 4.4mm*2.7mm, the pitch is 2.54mm, and the lead width is 7mm. The details are as shown in the figure;
4. Production: Use a comprehensive mold opening method to produce a 4.4mm width 1.27 pitch test seat, which can be made according to the structure of the traditional SOP aging seat;
5. Mold-opening products undergo strict tolerance control, and all production errors are tested to be qualified before they can be shipped.
