1. Actual requirements:
1.Package: QFN package
2. Number of Pins: 100
3. Number of grounding connections: 6pin
4. Chip type: MCU
5. Test requirements: MCU basic function detection
2. Demand analysis:
The QFN100 package test socket is mainly used for performance testing, which requires physical matching and matching of actual electrical testing requirements. First, let’s take a look at its physical testing. The size is 0.4mm pitch, 12x12x0.85mm; Secondly, in terms of electrical properties, this chip has a low power supply requirement of less than 3.3V and a frequency requirement of less than 50Mhz. The peripheral expansion circuit design requirements are not high, and the 100pin package design allows it to have more I /O expansion port; it contains a USB2.0 expansion port to facilitate better interactive communication with the device. Its QFN100 test socket only needs to meet the frequency requirement of 50Mhz and the speed standard of USB2.0.
3. Production: The production process of the test socket of the normal QFN package chip is adopted. According to the size of the chip, its basic test requirement interface is ensured. In addition, the chip test socket also needs to meet the normal test electrical requirements of the chip. At present, the properties of conventional probes can meet the requirements;
4. After production is completed, quality inspection of all sizes of the test seat will be carried out, and it will be issued after confirmation.
