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GDDR5 BGA170 2.8GHz high frequency test socket (with weldable adapter plate)

  • GDDR5 BGA170 2.8GHz high frequency test socket (with weldable adapter plate)

GDDR5 BGA170 2.8GHz high frequency test socket (with weldable adapter plate)

1. Actual requirements:

1.Package: BGA package

2.Pin number: 170pin

3. Spacing: 0.8mm

4. Chip type: Graphics card memory GDDR5 series

5. Testing requirements: chip functional debugging and testing the quality of GDDR5

2. Demand analysis: When GDDR5 is recycling materials or when matching the performance of different brands of particles on the same brand of graphics cards, it is necessary to use test fixtures for rapid testing, and quickly detect the video memory through the startup code. The detection process Video memory problems will be exposed in the video memory, so that the video memory can be screened quickly; in addition, the performance test is to use the corresponding test software to test it, run 3D Max, etc.; for multi-brand testing, the corresponding graphics card needs to be debugged to suit the requirements. Equipped with various brands of video memory.

3. Production: The above requirements indicate that the video memory test is diverse and may have many problems. The GDDR5 chip test socket is designed to have higher performance to withstand beatings. Multiple brands, over-current capabilities and high-frequency capabilities of the video memory , and model integrity puts forward very high requirements. The 2.8GHz design combines the current mainstream GDDR5 chip frequency design, and also allows high-speed working performance; a boss adapter plate is required at the bottom to raise the test socket. It is convenient to adapt to multiple chips and is close to the core display space of the main GPU; the signals are equal in length, and the chip has high frequency, high speed and large current multi-performance GDDR5. It comes with an adapter board (can be welded) that can adapt to a variety of graphics card components. .

4. This product has been gradually standardized. After production, particles are used for size matching detection, and each conduction interface is checked at the same time. Then the corresponding adapter board is adapted, the conduction is tested again, and then the product is packaged and shipped.

GDDR5 BGA170 2.8GHz high frequency test socket (with weldable adapter plate)

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