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BGA316 manual integrated test socket

  • BGA316 manual integrated test socket

BGA316 manual integrated test socket

1. Actual requirements:

1.Package: BGA package

2.Pin number: 316pin

3. Spacing: 1.0mm

4. Chip type: FPGA chip

5. Testing requirements: chip functional debugging and mass production

2. Demand analysis: The core rate and constant frequency of the FPGA chip are 10Gbps and 5GHz respectively. This performance is mainly used during debugging, and it is not used many times. It is mainly used in mass production after debugging. The current ATE volume The parameters are produced by robot operation, which has high requirements on the structure and force of the product, because the more pins there are, the higher the requirements on test pressure; the chip power consumption is not high, and there is no need to design separate heat dissipation requirements;

3. Production: After confirming the chip size, design the main tray structure closer to the chip and corresponding CNC machining of its tight via holes for placing high-performance probes. At the same time, design a separate structure that facilitates manual and automated production; used in Chip fixation during manual debugging and robot operation during automated testing;

4. During the production process, each component of the test seat is strictly inspected to confirm that each component is within the designed tolerance range. After all components are confirmed to be OK, the probes that match the high-frequency performance will be sent to the assembly department for assembly. After production is OK, the overall structural condition will be confirmed to be complete before being shipped to the user for final verification.

BGA316 manual integrated test socket

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