BGA225 CPU test stand
2. Actual requirements:
1.Package: BGA package
2. Number of Pins: 225
3. Number of grounding connections: 0pin
4. Chip type: CPU
5. Test requirements: chip function test
3. Demand analysis: BGA225 test frame, chip spacing 0.65mm, chip size 10*10mm. With such a structure, the dense probe array needs to match a uniform pressure of 4~7KG, and at the same time it needs to ensure that the chip is not damaged. Therefore, the test seat head needs to use a knob flip cover. The knob can provide uniform pressure for the chip, and the knob pushing pressure is greater. The structure of the test stand is mainly adjusted according to the components around the BGA225 chip. Other interfaces can be avoided. In addition, The probe adopts a pointed probe adapted to the 1.5Gbps rate, which can pass a current of less than 1A while ensuring normal contact;
4. Production: What needs to be noted about the BGA225 test stand is that its core product structure needs to be designed based on the CPU source test motherboard mechanism, while avoiding several important interfaces that users need to use, including 2.54mm external connections. Pin header and 2.0mm expansion socket pin header; Mic and antenna coaxial interface;
5. After the production is completed, quality inspection will be conducted on all sizes of the test socket, and a power-on test will be conducted to confirm whether the product is OK. After the power-on shooting and adaptation are sent to the user for confirmation, the product can be shipped.
