BGA85 screen main control chip flip test seat fixture
2. Actual requirements:
1.Package: BGA package
2. Number of Pins: 85
3. Number of grounding connections: 0pin
4. Chip type: screen driver main control chip
5. Testing requirements: chip function testing and programming purposes
3. Demand analysis: BGA package 85PIN, pitch 0.7, size 5*5. There are no special current rating requirements, and the temperature is normal. The requirements are not high, just use ordinary probes. The selection of probes is based on the chip spacing and whether there are balls or not. The substrate of the fixture is subject to the one provided by the customer. The components around the test socket should be avoided. This can better adapt to the testing requirements of this FPC screen.
4. Production: A semi-customized solution is adopted. The structure of the test socket can be used with the existing test socket structure. The difficulty in this production lies in the misalignment of densely populated chip pins, which requires strict processing tolerances;
5. After production is completed, quality inspection will be conducted on all dimensions of the test socket, and each dimension marked on the drawing will be strictly inspected. After confirmation, assembly can be completed; check whether the protrusion of the needle meets the design expectations. Check whether there is interference between components, whether each interface can be connected ok, etc.; whether the screen lights up normally.
