Package size: TOLL package, using MO-299 JEDEC standard package
Aging test support: test environment temperature -45~155℃, test duration 1000 hours, overcurrent one in and one out 3A aging test load.
Product Features: Suitable for chip basic performance debugging and HAST aging test
Product usage: Chips are mainly used in switching power supplies, green lighting, motor drives, automotive electronics, new energy charging piles, solar equipment, digital home appliances, security engineering and other industries.
Product highlights: Resistant to high current, single channel of the chip is above 3A, continuous output test of 100V high voltage requires a Kelvin-type knife-type probe to match the over-current requirements. The probe has low over-current internal resistance; it can be guaranteed during the functional aging test. The heat generation will not be very large. At the same time, the test socket shell has an aluminum alloy structure and anodized insulation, taking into account both insulation and heat dissipation.
TOLL package 9Pin 1.2mm pitch aging test socket