Package size: QFN package, 0.5mm pitch, 5*5mm size
Test support: MCU and EEPROM packaging, RF chip aging test purposes
Product features: high and low temperature resistance -45~155℃, strong temperature resistance of the shrapnel, low contact resistance, and stable contact;
Product use: aging test and programming of HAST, HTOL, PCT, etc. and the same package
QFN32 0.5 5*5 aging seat
