Package size: BGA package, butterfly package, 0.8mm pitch, 25*24
Test socket support: flip-top knob probe-type structure, requiring manual-automatic integrated design. The test socket needs to avoid fiber tail insertion.
For aging test, the power is less than 2W, the frequency is 100MHZ, the ball test, the temperature is -25-150 degrees, the relative humidity is 85%, and the insulation resistance is greater than or equal to 1000MΩ.
Product features: The front-end RF integration meets the high sensitivity requirements of the antenna, and the low-impedance high-frequency probe supports the capture of its signals; with the cooperation of independent power supply and backup power supply, other interfaces support expansion of IO and communication UART, I2C, and SPI interfaces, which is convenient High bit rate signal interworking.
Product usage: used for testing receiver chips such as satellite positioning SOC chips
Customized 44Pin DFB butterfly laser chip test socket
